Capability for HDI  board

Items

2023

2024

Sample

Mass
production

Sample

Mass
production

Layer count

12

10

14

12

Stack-up

4+n+4

3+n+3

Anylayer

Anylayer

Min board thickness(mm)

0.55

0.6

0.5

0.55

Min dielectric thickness(mm)

0.03

0.035

0.025

0.03

Min base copper thickness (oz)

1/3oz

1/3oz

1/3oz

1/3oz

Min line width / line space of inner layer(um)

40/40

40/50

40/40

40/50

Min line width / line space of outer layer(um)

40/50

50/50

40/50

50/50

Pitch min BGA size for blind hole(mm)

0.35

0.4

0.35

0.4

 Min blind hole(um)

65

75

65

75

Min PAD size for blind hole(um)

180

200

180

200

Plating aspect ratio for blind hole

1:1

0.8:1

1:1

0.8:1

Impedance(﹥50Ω)

±8%

±10%

±6%

±8%

Impedance(﹤50Ω)

±4ohm

±5ohm

±4ohm

±5ohm

 Solder mask registration(um)

±25

±35

±25

±30

 Min solder mask dam(mm)

0.05

0.05

0.05

0.05

 Min mechanical drill hole(mm)

0.15

0.2

0.15

0.2

Bow and twist

≦0.3%

≦0.5%

≦0.3%

≦0.5%

Outline tolerance(mm)

±0.075

±0.1

±0.075

±0.1