Capability for IC Substrate

Item

Specifications

Material

Shengyi,BT,Mitsubishi,Doushan,Toshiba,LG,Ajinomoto Buildup Film(ABF)，EPS

Sample

Mass Production

Layer count

2-10layer

2-6layer

Min Drilling

100um

100um

Bonding Finger

Min Pitch

95um

105um

Min Width

35um

35um

Circuit Line

Min Pitch

55un

95um

Min Width

25um

25um

Min Spacing

25um

25um

Min Weding ring

80um

80um

Min thickness

2L

100um

100um

4L

200um

300um

6L

300um

400um

Line to PAD/EDGE

100um

100um

Soldermask

Solder PAD

50um

50um

Solder DAM

70um

80um

Thickness

20±5um

20±5um

Flatness

5um

5um

Surface treatment

Hard gold

Ni:5-15um，Au:0.2-2um

Ni:5-15um，Au:0.2-0.5um

Soft gold

Ni:5-15um，Au:0.3-2um

Ni:5-15um，Au:0.3-0.8um

ENEPIG-WB

Ni:3-8um，Pd:0.1-0.2um，Au:0.1-2um

Ni:3-8um，Pd:0.1-0.2um，Au:0.1-0.2um

ENEPIG-SMT

Ni:3-8um，Pd:0.05-0.15um，Au:0.05-2um

Ni:3-8um，Pd:0.05-0.15um，Au:0.05-0.15um

OSP

OSP:0.1-0.3UM

OSP:0.1-0.3UM