Capability for  high multilayer board

Items

2023

2024

Sample

Mass
production

Sample

Mass
production

Layers

36

30

40

32

Max board thickness(mm)

10

8

10

10

Min board thickness(mm)

0.5

0.5

0.5

0.5

Panel size(mm)

620*1200

620*920

620*1200

620*1200

Min/max base copper thickness(oz)

Hoz/6oz

Hoz/6oz

Hoz/6oz

Hoz/6oz

Min core thickness(um)

50

50

50

50

Min line width / line space of inner layer(um)

66/76

76/76

66/76

76/76

Min line width / line space of outer layer(um)

76/76

76/76

76/76

76/76

Min copper pad size(mm)

0.35

0.35

0.35

0.35

Min BGA center distance(mm)

0.4

0.5

0.4

0.5

Drill hole

Mechanical min aperture(mm)

0.15

0.15

0.15

0.15

Laser min aperture(mm)

0.1

0.1

0.075

0.1

Min crimping hole tolerance(mm)

±0.05

±0.05

±0.05

±0.05

Back drilling to copper(mm)

0.11

0.125

0.11

0.125

Back drill stub(mm)

0.125±0.075

0.15±0.1

0.125±0.075

0.15±0.1

Thickness
diameter ratio

Mechanical drilling hole diameter 0.15mm

20:1

16:1

20:1

16:1

Mechanical drilling hole diameter 0.2mm

23:1

20:1

23:1

20:1

Impedance
tolerance

Inner

±5%

±8%

±5%

±8%

Outer

±8%

±10%

±8%

±9%

Resin plug hole (vacuum)

Min plug hole diameter(mm)

0.15

0.2

0.15

0.2

Max thickness diameter ratio
with aperture of 0.2mm

14:1

12:1

14:1

12:1

Resistance welding

Green oil counterpoint(um)

±25

±35

±25

±35

Min green oil bridge(mm)

0.064

0.075

0.05

0.075

Thickness diameter ratio of
resistance welding plug hole

14:1

12:1

14:1

12:1

Plate warpage control %

≤0.5%

≤0.5%

≤0.3%

≤0.5%

Surface treatment

ENIG，OSP，HAL-LF，Gold， gold+OSP，Tin，G/ F+OSP， G / F+gold