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Capability for high multilayer board |
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Items |
2023 |
2024 |
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Sample |
Mass |
Sample |
Mass |
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Layers |
36 |
30 |
40 |
32 |
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Max board thickness(mm) |
10 |
8 |
10 |
10 |
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Min board thickness(mm) |
0.5 |
0.5 |
0.5 |
0.5 |
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Panel size(mm) |
620*1200 |
620*920 |
620*1200 |
620*1200 |
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Min/max base copper thickness(oz) |
Hoz/6oz |
Hoz/6oz |
Hoz/6oz |
Hoz/6oz |
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Min core thickness(um) |
50 |
50 |
50 |
50 |
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|
Min line width / line space of inner layer(um) |
66/76 |
76/76 |
66/76 |
76/76 |
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Min line width / line space of outer layer(um) |
76/76 |
76/76 |
76/76 |
76/76 |
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Min copper pad size(mm) |
0.35 |
0.35 |
0.35 |
0.35 |
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Min BGA center distance(mm) |
0.4 |
0.5 |
0.4 |
0.5 |
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Drill hole |
Mechanical min aperture(mm) |
0.15 |
0.15 |
0.15 |
0.15 |
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Laser min aperture(mm) |
0.1 |
0.1 |
0.075 |
0.1 |
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Min crimping hole tolerance(mm) |
±0.05 |
±0.05 |
±0.05 |
±0.05 |
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Back drilling to copper(mm) |
0.11 |
0.125 |
0.11 |
0.125 |
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Back drill stub(mm) |
0.125±0.075 |
0.15±0.1 |
0.125±0.075 |
0.15±0.1 |
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Thickness |
Mechanical drilling hole diameter 0.15mm |
20:1 |
16:1 |
20:1 |
16:1 |
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Mechanical drilling hole diameter 0.2mm |
23:1 |
20:1 |
23:1 |
20:1 |
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Impedance |
Inner |
±5% |
±8% |
±5% |
±8% |
|
Outer |
±8% |
±10% |
±8% |
±9% |
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|
Resin plug hole (vacuum) |
Min plug hole diameter(mm) |
0.15 |
0.2 |
0.15 |
0.2 |
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Max thickness diameter ratio |
14:1 |
12:1 |
14:1 |
12:1 |
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Resistance welding |
Green oil counterpoint(um) |
±25 |
±35 |
±25 |
±35 |
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Min green oil bridge(mm) |
0.064 |
0.075 |
0.05 |
0.075 |
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Thickness diameter ratio of |
14:1 |
12:1 |
14:1 |
12:1 |
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Plate warpage control % |
≤0.5% |
≤0.5% |
≤0.3% |
≤0.5% |
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Surface treatment |
ENIG，OSP，HAL-LF，Gold， gold+OSP，Tin，G/ F+OSP， G / F+gold |
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