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Capability for IC Substrate |
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Item |
Specifications |
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Material |
Shengyi,BT,Mitsubishi,Doushan,Toshiba,LG,Ajinomoto Buildup Film(ABF)，EPS |
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Sample |
Mass Production |
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Layer count |
2-10layer |
2-6layer |
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Min Drilling |
100um |
100um |
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Bonding Finger |
Min Pitch |
95um |
105um |
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Min Width |
35um |
35um |
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Circuit Line |
Min Pitch |
55un |
95um |
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Min Width |
25um |
25um |
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Min Spacing |
25um |
25um |
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Min Weding ring |
80um |
80um |
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Min thickness |
2L |
100um |
100um |
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4L |
200um |
300um |
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6L |
300um |
400um |
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Line to PAD/EDGE |
100um |
100um |
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Soldermask |
Solder PAD |
50um |
50um |
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Solder DAM |
70um |
80um |
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Thickness |
20±5um |
20±5um |
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Flatness |
5um |
5um |
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Surface treatment |
Hard gold |
Ni:5-15um，Au:0.2-2um |
Ni:5-15um，Au:0.2-0.5um |
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Soft gold |
Ni:5-15um，Au:0.3-2um |
Ni:5-15um，Au:0.3-0.8um |
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ENEPIG-WB |
Ni:3-8um，Pd:0.1-0.2um，Au:0.1-2um |
Ni:3-8um，Pd:0.1-0.2um，Au:0.1-0.2um |
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ENEPIG-SMT |
Ni:3-8um，Pd:0.05-0.15um，Au:0.05-2um |
Ni:3-8um，Pd:0.05-0.15um，Au:0.05-0.15um |
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OSP |
OSP:0.1-0.3UM |
OSP:0.1-0.3UM |
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