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Capability for FPC |
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|
Items |
Standard |
Special |
|
Layer count |
1-8 |
10 |
|
Max panel size |
250*450mm |
NA |
|
Min panel size |
10*15mm |
NA |
|
Max board thickness/Min board thickness |
0.75/0.05mm |
NA |
|
Board thickness tolerance(0.1mm≤board thickness﹤0.4mm) |
±0.03mm |
±0.02mm |
|
Max drill aperture/Min drill aperture |
6.4mm/0.04mm |
NA |
|
Min green oil bridge |
0.2mm |
NA |
|
Max base copper thickness/Min base copper thickness |
35um/6um |
NA |
|
Max dielectric thickness/Min dielectric thickness |
50um/12um |
NA |
|
Stiffener material |
PI/FR4/metal |
NA |
|
Tooling tolerance |
±0.03mm |
±0.02mm |
|
Via(Laser) tolerance |
±0.025mm |
NA |
|
Hole site tolerance |
±0.05mm |
NA |
|
Min line width / line space |
40um/40um |
35um/35um |
|
Etch tolerance |
±0.02mm |
±0.015mm |
|
Min SM thickness |
10um |
NA |
|
Max punch panel size |
250mm*200mm |
NA |
|
Outline tolerance |
±0.1mm |
±0.05mm |
|
Tolerance of hole to outline |
±0.1mm |
±0.07mm |
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Thermal Stressing |
288±5℃，10s，3times |
|
|
Surface treatment |
G / F+gold，ENIG，OSP |
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