|
Capability for HDI board |
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|
Items |
2023 |
2024 |
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|
Sample |
Mass |
Sample |
Mass |
|
|
Layer count |
12 |
10 |
14 |
12 |
|
Stack-up |
4+n+4 |
3+n+3 |
Anylayer |
Anylayer |
|
Min board thickness(mm) |
0.55 |
0.6 |
0.5 |
0.55 |
|
Min dielectric thickness(mm) |
0.03 |
0.035 |
0.025 |
0.03 |
|
Min base copper thickness (oz) |
1/3oz |
1/3oz |
1/3oz |
1/3oz |
|
Min line width / line space of inner layer(um) |
40/40 |
40/50 |
40/40 |
40/50 |
|
Min line width / line space of outer layer(um) |
40/50 |
50/50 |
40/50 |
50/50 |
|
Pitch min BGA size for blind hole(mm) |
0.35 |
0.4 |
0.35 |
0.4 |
|
Min blind hole(um) |
65 |
75 |
65 |
75 |
|
Min PAD size for blind hole(um) |
180 |
200 |
180 |
200 |
|
Plating aspect ratio for blind hole |
1:1 |
0.8:1 |
1:1 |
0.8:1 |
|
Impedance(﹥50Ω) |
±8% |
±10% |
±6% |
±8% |
|
Impedance(﹤50Ω) |
±4ohm |
±5ohm |
±4ohm |
±5ohm |
|
Solder mask registration(um) |
±25 |
±35 |
±25 |
±30 |
|
Min solder mask dam(mm) |
0.05 |
0.05 |
0.05 |
0.05 |
|
Min mechanical drill hole(mm) |
0.15 |
0.2 |
0.15 |
0.2 |
|
Bow and twist |
≦0.3% |
≦0.5% |
≦0.3% |
≦0.5% |
|
Outline tolerance(mm) |
±0.075 |
±0.1 |
±0.075 |
±0.1 |
